CommScope Author

Mark is engineering director, Enclosure Solutions, responsible for directing innovation efforts in wireless communications enclosure systems for CommScope, with particular focus on thermal design, power systems and other efficiency drivers. He brings 30-plus years of expertise in electronic packaging, with backgrounds in both defense electronics and telecommunications for such names as Texas Instruments, Fujitsu and Xtera Communications. Mark holds 12 U.S. patents and is a registered professional engineer in the state of Texas. He holds a Bachelor of Science degree in mechanical engineering from  Clemson University, and a Master of Science degree in mechanical engineering from Southern Methodist University.